Description
Hand-finished 3D print. Minor variations in colour, surface finish, and visible layer lines are normal and part of the print process — they do not affect fit or function.
Screwed-together assembly. The top shell fastens to the heatsink base with screws for a very snug fit. Because it is a 3D print, repeatedly taking the case apart will gradually loosen that fit — so we recommend disassembling it only when you need to.
A two-part thermal enclosure for the Radxa Rock Pi 4B+ single-board computer. The kit ships complete:
- Aluminum heatsink base — milled aluminum block that contacts the SoC, PMIC, and RAM via thermal pads for passive cooling.
- 3D-printed top shell — printed in-house on FDM, designed to mate cleanly with the heatsink base and expose every port (HDMI, USB, Ethernet, GPIO, DSI/CSI).
- Pre-applied thermal pads, fasteners, and feet included.
About the 3D-Printed Top
Each top shell is printed and finished by hand. Because of that, every unit is slightly different — you may see faint layer lines, small colour shifts between batches, or tiny surface marks. None of these affect how the case fits the board or how well it cools. If you want a uniform machined look, this case isn’t for you; if you appreciate something a little more bespoke, it should fit right in.
Compatibility
Designed and tested with the Radxa Rock Pi 4B+. Not compatible with the Rock Pi 4A or 4C revisions.
